Product CollectionIntel® NUC Kit with 8th Generation Intel® Core™ Processors
Code NameProducts formerly BEAN CANYON
StatusLaunched
Launch DateQ3'18
Board Form FactorUCFF (4" x 4")
SocketSoldered-down BGA
Internal Drive Form FactorM.2 and 2.5" Drive
# of Internal Drives Supported2
Lithography14 nm
TDP28 W
DC Input Voltage Supported12-19 VDC
Processor IncludedIntel® Core™ i7-8559U Processor (8M Cache, up to 4.50 GHz)
Warranty Period3 yrs
Supplemental Information
Embedded Options AvailableNo
Datasheet
DescriptionOther features: Includes Thunderbolt 3 (40Gbps) USB 3.1 Gen 2 (10Gbps) and DP 1.2 via USB-C; also includes microSDXC card slot, dual microphones
Product Brief
Memory & Storage
Max Memory Size (dependent on memory type)32 GB
Memory TypesDDR4-2400 1.2V SO-DIMM
Max # of Memory Channels2
Max Memory Bandwidth38.4 GB/s
Max # of DIMMs2
ECC Memory Supported ‡No
Processor Graphics
Integrated Graphics ‡Yes
Graphics OutputHDMI 2.0a; USB-C (DP1.2)
# of Displays Supported ‡3
Expansion Options
PCI Express RevisionGen3
PCI Express Configurations ‡M.2 slot with PCIe X4 lanes
Removable Memory Card SlotmicroSDXC with UHS-I support
M.2 Card Slot (storage)22x42/80
I/O Specifications
# of USB Ports6
USB Configuration2x front and 3x rear USB 3.1 Gen2; 2x USB 2.0 via internal headers
USB Revision2.0, 3.1 Gen2
USB 2.0 Configuration (External + Internal)0 + 2
USB 3.0 Configuration (External + Internal)2B 2F + 0
Total # of SATA Ports2
Max # of SATA 6.0 Gb/s Ports2
RAID Configuration2.5" HDD/SSD + M.2 SATA SSD (RAID-0 RAID-1)
Audio (back channel + front channel)7.1 digital (HDMI mDP); L+R mic (F)
Integrated LANIntel® Ethernet Connection I219-V
Integrated Wireless‡Intel® Wireless-AC 9560 + Bluetooth 5.0
Integrated BluetoothYes
Consumer Infrared Rx SensorYes
Additional HeadersCEC, 2x USB2.0, FRONT_PANEL
# of Thunderbolt™ 3 Ports1
Package Specifications
Chassis Dimensions117 x 112 x 51mm
Advanced Technologies
Intel® Optane™ Memory Supported ‡Yes
Intel® Virtualization Technology for Directed I/O (VT-d) ‡Yes